Die bonding apparatus and die bonding method

A die bonding apparatus, comprising:

• a mounting base including a mounting area on which a first member is mounted;
• a heater arranged below the mounting base;
• a side wall configured to surround the mounting area;
• a collet configured to hold a second member by vacuum-chucking at an end portion;
• a lid including a hole configured to allow the first and second members pass therethrough, the lid being mounted on the side wall;
• a moving structure configured to move the collet to transport the second member held by the collet through the hole for bonding the second member to the first member;
• and
• a gas-supplying tube arranged on the side wall and configured to supply a heating gas to a heating space formed by the side wall and the lid, wherein
• the lid contains a material capable of:
• reflecting an infrared radiation caused by the heater and the heating gas;
• or absorbing and re-radiating the infrared radiation.