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US 2017/0365575 A1Published application
Packaged IC With Solderable Sidewalls
AssigneeTexas Instruments Incorporated
InventorsYong Lin, Vikas Gupta, Rongwei Zhang
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Abstract
A packaged IC wherein a portion of the sidewalls of the packaged IC are solderable metal. A method of forming a packaged IC wherein a portion of the sidewalls of the wire bond pads or the flip chip pads that are exposed by sawing during singulation are solderable metal. A method of forming a packaged IC wherein all of the sidewalls of the wire bond pads or the flip chip pads that are exposed by sawing during singulation are solderable metal and a portion of sidewall of the molding compound is solderable metal.
Claims8
A packaged IC comprising:
- an IC chip;
- an IC chip pad coupled to the IC chip;
- a wire bond pad or a flip chip pad coupled to the IC chip, the wire bond pad or flip chip pad having an exposed sidewall;
- molding compound encapsulating the IC chip, a portion of the IC chip pad, and a portion of the wire bond pad, the molding compound having a sidewall;
- and
- a first solderable metal extending from a bottom surface of the packaged IC along a sidewall of the packaged IC.
3 more elements
Dependencies are inferred from the claim text.