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US 2017/0365569 A1Published application
Contact Bumps and Methods of Making Contact Bumps on Flexible Electronic Devices
AssigneeSMARTRAC TECHNOLOGY GmbH
InventorFrank Kriebel
Life of this patent
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Abstract
Contact bumps between a contact pad and a substrate can include a rough surface that can mate with the material of the substrate of which may be flexible. The rough surface can enhance the bonding strength of the contacts, for example, against shear and tension forces, especially for flexible systems such as smart label and may be formed via roller or other methods.
Claims20
A contact connection, comprising:
- a contact pad, wherein
- the contact pad comprises a pad surface;
- a contact bump, wherein
- the contact bump is coupled to a flexible electronic element,
- the contact bump comprises a rough surface,
- the contact bump comprises one or more protuberances arranged along a periphery of the surface,
- the contact bump is connected to the contact pad, forming a contact connection between the contact bump and the contact pad.
4 more elements
A method for forming a contact connection comprising:
- providing a contact pad with pad surface on a flexible substrate,
- providing a contact bump coupled to a flexible electronic element, which is at least one of a flexible chip, device, semiconductor or display element,
- depositing a material during the formation of the contact bump wherein the material forms a rough surface, and
- connecting the contact bump to the contact pad.
1 more element
Dependencies are inferred from the claim text.