Electronic part embedded substrate and method of producing an electronic part embedded substrate

An electronic part embedded substrate comprising:

• a first substrate;
• a second substrate provided on the first substrate;
• an electronic part provided between the first substrate and the second substrate;
• an electrically connecting member provided between the first substrate and the second substrate;
• and
• an encapsulation member configured to fill a space between the first substrate and the second substrate,
• wherein the electronic part and the electrically connecting member are encapsulated by the encapsulation member,
• wherein the first substrate includes a first wiring and a second wiring for an external connection terminal, the first wiring being provided on an upper surface of the first substrate, the second wiring being provided on a lower surface of the first substrate,
• wherein the second substrate includes a third wiring for mounting another electronic part and a fourth wiring, the third wiring being provided on an upper surface of the second substrate, the fourth wiring being provided on a lower surface of the second substrate,
• wherein the electrically connecting member includes a solder layer coating a spacer, and
• wherein the electrically connecting member connects the first wiring to the fourth wiring.