Fan-out semiconductor package

A fan-out semiconductor package, comprising:

• a first connection member having a through hole;
• a semiconductor chip disposed in the through hole of the first connection member and having an active surface on which connection pads are disposed and an inactive surface disposed opposite the active surface;
• an encapsulant encapsulating at least a portion of the first connection member and the semiconductor chip;
• and
• a second connection member disposed on the first connection member and the active surface of the semiconductor chip and including a first region corresponding to a central portion of the through hole and a second region, surrounding the first region, corresponding to the central portion of the through hole,
• wherein the first region of the second connection member includes a first via and a second via, electrically connected to one of the connection pads, disposed in different layers, and connected by a redistribution layer, disposed in the first region;
• the second region of the second connection member includes a third via and a fourth via, electrically connected to another of the connection pads, disposed in different layers, and connected by the redistribution layer, disposed in the second region;
• and a distance between axes of the first via and the second via is shorter than a distance between axes of the third via and the fourth via.