Semiconductor device, manufacturing method, and conductive post

Abstract

A semiconductor device comprises a semiconductor element 12 including electrodes 12G, 12S on a front surface and conductive posts 14, 14′, 14″ including one end which is soldered to electrodes 12G, 12S of the semiconductor element 12. The conductive posts 14, 14′, 14″ includes a solder absorbing portion 14b having a larger surface area per unit length than that of a bottom portion at a position apart from the one end by a length equal to a height of a bottom portion 14a in an extending direction. When the conductive post is joined by a solder, the solder melted and flowing across a surface of the conductive post is absorbed in a large surface of the solder absorbing portion, thereby preventing the solder from reaching a wiring substrate.

Dependencies are inferred from the claim text.