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US 2017/0365545 A1Published application
Resin board, method of manufacturing resin board, circuit board, and method of manufacturing circuit board
AssigneeFujitsu Limited
InventorsYasushi Kobayashi, Yoshihiro NAKATA, Yoshikatsu Ishizuki, Daijiro Ishibashi, Shinya Sasaki
Life of this patent
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Abstract
A resin board includes: a resin layer and a through electrode buried in the resin layer, wherein the through electrode has an electrode surface exposed from a front surface or a back surface of the resin layer and a lateral surface, and the electrode surface and the lateral surface form an obtuse angle.
Claims18
A resin board comprising:
- a resin layer;
- and
- a through electrode buried in the resin layer,
- wherein the through electrode has an electrode surface exposed from a front surface or a back surface of the resin layer and a lateral surface, and
- the electrode surface and the lateral surface form an obtuse angle.
2 more elements
A circuit board comprising:
- a resin board including a resin layer and a through electrode included in the resin layer;
- and
- a wiring structure formed on the resin board and having a wiring layer,
- wherein the through electrode has an electrode surface exposed from a front surface or a back surface of the resin layer and a lateral surface,
- the electrode surface and the lateral surface form an obtuse angle, and
- the electrode surface of the through electrode is connected to the wiring layer of the wiring structure.
3 more elements
A method of manufacturing a resin board, the method comprising:
- erecting a through electrode on a support board through an adhesion layer;
- forming a resin layer by burying the through electrode in a sealing resin;
- and
- peeling the resin layer from the adhesion layer,
- wherein the through electrode has an electrode surface exposed from a surface of the resin layer where the adhesion layer is peeled, and a lateral surface, and
- the electrode surface and the lateral surface form an obtuse angle.
3 more elements
A method of manufacturing a circuit board, the method comprising:
- erecting a through electrode on a support board through an adhesion layer;
- forming a resin layer by burying the through electrode in a sealing resin;
- peeling the resin layer from the adhesion layer;
- forming a wiring structure on the resin board by connecting a wiring layer to an electrode surface of the through electrode;
- exposing the through electrode by grinding a surface of the resin layer opposite to a surface where the adhesion layer is peeled.
2 more elements
Dependencies are inferred from the claim text.