Semiconductor device package
AssigneeAdvanced Semiconductor Engineering, Inc.
InventorsKay Stefan ESSIG, Chi-Tsung CHIU, Hui Hua LEE
Life of this patent
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Abstract
A semiconductor device package includes a first conductive base, a first semiconductor die, a dielectric layer, a first patterned conductive layer, and a second patterned conductive layer. The first conductive base defines a first cavity. The first semiconductor die is on a bottom surface of the first cavity. The dielectric layer covers the first semiconductor die, the first surface and the second surface of the first conductive base and fills the first cavity. The first patterned conductive layer is on a first surface of the dielectric layer. The second patterned conductive layer is on a second surface of the dielectric layer.
Claims20
A semiconductor device package, comprising:
- a first conductive base having a first surface and a second surface opposite to the first surface and defining a first cavity in the first surface of the first conductive base, the first cavity having a bottom surface;
- a first semiconductor die disposed on the bottom surface of the first cavity;
- a dielectric layer disposed on the first semiconductor die, the first surface and the second surface of the first conductive base and filling the first cavity, wherein the dielectric layer has a first surface and a second surface opposite to the first surface;
- a first patterned conductive layer disposed on the first surface of the dielectric layer;
- a second patterned conductive layer disposed on the second surface of the dielectric layer;
- a plurality of first interconnection structures disposed in the dielectric layer and electrically connected to the first semiconductor die and the first patterned conductive layer;
- and
- a plurality of second interconnection structures disposed in the dielectric layer and electrically connected to the second surface of the first conductive base and the second patterned conductive layer.
A semiconductor device package, comprising:
- a conductive base having a first surface and a second surface opposite to the first surface, and defining a cavity in the first surface of the first conductive base, the cavity having a bottom surface;
- a first semiconductor die disposed on the bottom surface of the cavity;
- a second semiconductor die disposed on the first semiconductor die;
- a dielectric layer disposed on the first surface of the conductive base, the first semiconductor die and the second semiconductor die and filling the cavity, wherein the dielectric layer has a first surface;
- a first patterned conductive layer and a second patterned conductive layer disposed on the first surface of the dielectric layer;
- a plurality of first interconnection structures disposed in the dielectric layer and electrically connected to the first semiconductor die and the first patterned conductive layer;
- and
- a plurality of second interconnection structures in the dielectric layer and electrically connected to the second semiconductor die and the second patterned conductive layer.
An semiconductor device package, comprising:
- a conductive base having a first surface and a second surface opposite to the first surface, and defining a cavity in the first surface of the conductive base, the cavity having a bottom surface;
- a first semiconductor die disposed on the bottom surface of the cavity;
- a first dielectric layer disposed on the first surface of the conductive base and the first semiconductor die, wherein the first dielectric layer has a first surface;
- a first patterned conductive layer disposed on the first dielectric layer and electrically connected to the first semiconductor die;
- a second semiconductor die disposed on the first patterned conductive layer;
- a second dielectric layer disposed on the first patterned conductive layer, the first surface of the first dielectric layer, and the second semiconductor die;
- and
- a second patterned conductive layer disposed on the second dielectric layer and electrically connected to the second semiconductor die.
Dependencies are inferred from the claim text.