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US 2017/0365541 A1Published application
Power module
AssigneeDanfoss Silicon Power GmbH
InventorsRonald EISELE, Frank OSTERWALD
Life of this patent
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Abstract
A power module (10) having a leadframe (20), a power semiconductor (30) arranged on the leadframe (20), a base plate (40) for dispersing heat generated by the power semiconductor (30) and a potting compound (50) surrounding the leadframe (20) and the power semiconductor (30), that physically connects the power semiconductor (30) and/or the leadframe (20) to the base plate (40).
Claims20
A power module having
- a leadframe,
- a power semiconductor arranged on the leadframe,
- a base plate for dispersing heat generated by the power semiconductor, and
- a potting compound surrounding the leadframe and the power semiconductor, that physically connects the power semiconductor and/or the leadframe to the base plate.
1 more element
A method for manufacturing a power module having a leadframe, a power semiconductor, and a base plate, having the following steps
- connecting the power semiconductor to the leadframe, and
- potting the power semiconductor connected to the leadframe with a potting compound while at the same time physically connecting the base plate to the potting compound.
Dependencies are inferred from the claim text.