Thin film based fan out and multi die package platform
AssigneeGlobalfoundries Inc.
InventorScott JEWLER
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Abstract
Thin film based fan out wafer level packaging and a method of manufacturing the same are disclosed. Embodiments include a method including forming tapered via holes in a first surface of a polymer film; forming a conductive pillar on the first surface of a semiconductor device; bonding a solderable surface of the conductive copper pillars to metallization on the second side of the polymer film; bonding the semiconductor device to the first surface of the polymer film over the conductive pillars with an underfill material; and depositing an encapsulant material over the semiconductor device and polymer film.
Claims20
A device comprising:
- a polymer film having tapered vias formed therein;
- a semiconductor device having conductive pillars with deposited solder on a surface opposite the semiconductor device and the conductive pillars being bonded to a first surface of the polymer film over the conductive pillars with an underfill material;
- and
- an encapsulant material deposited over the semiconductor device and polymer film,
- wherein the underfill material bonds a surface of the semiconductor device to the first surface of the polymer film to permit movement during temperature cycling.
A device comprising:
- a polymer film having tapered vias formed therein;
- a semiconductor device having conductive pillars with deposited solder on a surface opposite the semiconductor device and the conductive pillars being bonded to a first surface of the polymer film over the conductive pillars with an underfill material;
- and
- an encapsulant material deposited over the semiconductor device and polymer film,
- wherein the underfill material is in direct contact with a plurality is sides of each conductive pillar and fills a portion of each tapered via hole.
A device comprising:
- a polymer film layer having tapered vias formed therein;
- a semiconductor device having conductive pillars with deposited solder on a surface opposite the semiconductor device and the conductive pillars being bonded to a first surface of the polymer film over the conductive pillars with an underfill material;
- and
- an encapsulant material deposited over the semiconductor device and polymer film,
- wherein the polymer film layer comprises a plurality of polymer film layers and a plurality of patterned conductors connected by conductive vias either between two adjacent layers of patterned conductors or between non-adjacent layers of patterned conductors.
Dependencies are inferred from the claim text.