High Voltage Power Electronics Module For Subsea Applications
AssigneeABB Schweiz AG
InventorsDavid Guillon, Heinz Lendenmann, Hui Huang
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Abstract
The present disclosure relates to a high voltage power electronics module for subsea applications. The power electronics module includes: a baseplate, a power semiconductor chip arranged on the baseplate, and an encapsulation structure arranged on the baseplate and configured to encapsulate the power semiconductor chip, wherein the encapsulation structure is an epoxy having an elastic modulus less in a range of 1 to 20 Giga Pascal, GPa, at room temperature and a coefficient of thermal expansion less than 20 ppm/K.
Claims14
A high voltage power electronics module for subsea applications, wherein the power electronics module comprises:
- a baseplate,
- a power semiconductor chip arranged on the baseplate, and
- an encapsulation structure arranged on the baseplate and configured to encapsulate the power semiconductor chip,
- wherein the encapsulation structure is an epoxy having an elastic modulus in a range of 1 to 20 Giga Pascal, GPa, at room temperature and a coefficient of thermal expansion less than 20 ppm/K.
Dependencies are inferred from the claim text.