Semiconductor packages with sub-terminals and related methods

A method of forming a semiconductor device package, comprising:

• coupling a plurality of die with a substrate, each die coupled to the substrate at a first surface of the die and at a second surface of the substrate, the substrate comprising a first surface on a side of the substrate opposing the second surface of the substrate, each of the plurality of die having a second surface on an opposing side of the die from the first surface of the die;
• coupling each first surface of a plurality of conductive pillars to the second surface of the substrate, each conductive pillar electrically coupled with one of the plurality of die, each conductive pillar comprising a second surface on a side of the conductive pillar opposing the first surface of the conductive pillar;
• encapsulating each of the plurality of die and a portion of each conductive pillar in a mold compound, forming a plurality of coupled semiconductor packages,
• after encapsulating, singulating the plurality of coupled semiconductor packages to form a plurality of singulated semiconductor packages;
• coupling a pin to one of the conductive pillars;
• and
• coupling a case over the second surface of the substrate while extending the pin through an opening in the case.

A method of forming a semiconductor device package, comprising:

• coupling a plurality of die with a substrate, each die coupled to the substrate at a first surface of the die and at a second surface of the substrate, the substrate comprising a first surface on a side of the substrate opposing the second surface of the substrate, each of the plurality of die having a second surface on an opposing side of the die from the first surface of the die;
• coupling each first surface of a plurality of conductive pillars to the second surface of the substrate, each conductive pillar electrically coupled with one of the plurality of die, each conductive pillar comprising a second surface on a side of the conductive pillar opposing the first surface of the conductive pillar;
• encapsulating each of the plurality of die and a portion of each conductive pillar in a mold compound, forming a plurality of coupled semiconductor packages,
• after encapsulating, singulating the plurality of coupled semiconductor packages to form a plurality of singulated semiconductor packages;
• coupling an L-shaped pin to one of the conductive pillars;
• and
• integrally forming a case over the L-shaped pin.