System and Method for Decapsulation of Plastic Integrated Circuit Packages
AssigneeJIACO Instruments Holding B.V.
InventorJiaqi Tang
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Abstract
System and method for decapsulation of plastic integrated circuit packages by providing a microwave generator, providing a Beenakker resonant cavity connected to the microwave generator, which cavity comprises a coupling antenna loop, providing the cavity with a tube or tubes for supply of plasma gas and etchant gas or gases and with means for igniting the plasma gas, and providing that the cavity is set at a predefined value of its Q factor by embodying the coupling antenna loop and/or a wire optionally attached to the coupling antenna loop in a metal or metal alloy, or providing that at least at part of its surface area the coupling antenna loop and/or the wire is coated with a metal or metal alloy different than copper and with a higher resistivity than copper.
Claims15
A system for decapsulation of plastic integrated circuit packages, comprising a microwave generator and a Beenakker resonant cavity connected to the microwave generator, wherein said Beenakker cavity has a predefined Q factor and is provided with a tube or tubes for supply of plasma gas and etchant gas or gases and with means for igniting the plasma gas, which Beenakker resonant cavity comprises a coupling antenna loop which is optionally provided with a wire attached to the coupling antenna loop, and wherein the Q factor of the Beenakker resonant cavity is set at a predefined value by arranging that the coupling antenna loop and/or said wire optionally attached to the coupling antenna loop is implemented in a metal or metal alloy different than copper and with a higher resistivity than copper (1.724×10−8 ohm·m), or that at least at part of its surface area the coupling antenna loop and/or said wire is provided with a coating of a metal or metal alloy different than copper and with a higher resistivity than copper (1.724×10−8 ohm·m).
A method for decapsulation of plastic integrated circuit packages, comprising the steps of:
- providing a microwave generator;
- providing a Beenakker resonant cavity connected to the microwave generator, which Beenakker resonant cavity comprises a coupling antenna loop;
- providing the Beenakker resonant cavity with a tube or tubes for supply of plasma gas and etchant gas or gases and with means for igniting the plasma gas;
- optionally providing a wire to the coupling antenna loop, and
- providing that the Beenakker resonant cavity is set at a predefined value of its Q factor by embodying the coupling antenna loop and/or said wire optionally attached to the coupling antenna loop in a metal or metal alloy different than copper and with a higher resistivity than copper (1.724×10−8 ohm·m), or providing that at least at part of its surface area the coupling antenna loop and/or said wire is coated with a metal or metal alloy different than copper and with a higher resistivity than copper (1.724×10−8 ohm·m).
A Beenakker cavity comprising a coupling antenna loop which is optionally provided with a wire attached to the coupling antenna loop, wherein the coupling antenna loop and/or said wire optionally attached to the coupling antenna loop is implemented in a metal or metal alloy different than copper and with a higher resistivity than copper (1.724×10−8 ohm·m), or at at least part of its surface area the coupling antenna loop and/or said wire is provided with a coating of a metal or metal alloy different than copper and with a higher resistivity than copper (1.724×10−8 ohm·m).
Dependencies are inferred from the claim text.