Methods for polymer coefficient of thermal expansion (cte) tuning by microwave curing
AssigneeApplied Materials, Inc.
InventorsYUEH SHENG OW, RUI WANG, TUCK FOONG KOH, XIN WANG
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Abstract
Methods of curing polyimide to tune the coefficient of thermal expansion are provided herein. In some embodiments, a method of curing a polymer layer on a substrate, includes: (a) applying a variable frequency microwave energy to the substrate to heat the polymer layer and the substrate to a first temperature; and (b) adjusting the variable frequency microwave energy to increase a temperature of the polymer layer and the substrate to a second temperature to cure the polymer layer.
Claims20
A method of curing a polymer layer on a substrate, comprising:
- (a) applying a variable frequency microwave energy to the substrate to heat the polymer layer and the substrate to a first temperature;
- and
- (b) adjusting the variable frequency microwave energy to increase a temperature of the polymer layer and the substrate to a second temperature to cure the polymer layer.
A method of curing a polymer layer on a substrate, comprising:
- (a) applying a variable frequency microwave energy to the substrate to heat the polymer layer and the substrate to a first temperature of about 170 to about 200 degrees Celsius for a first period of time;
- and
- (b) adjusting the variable frequency microwave energy to increase a temperature of the polymer layer and the substrate to a second temperature of about 300 to about 400 degrees Celsius for a second period of time to cure the polymer layer, wherein (a)-(b) are performed within a microwave processing chamber under vacuum.
A method of curing a polyimide layer on a substrate, comprising:
- (a) applying a variable frequency microwave energy at microwave frequencies ranging from about 5.85 GHz to about 6.65 GHz, and at a sweep rate of about 0.25 microseconds per frequency, to the substrate to heat the polyimide layer and the substrate to a first temperature of about 170 to about 200 degrees Celsius, wherein the polyimide layer and the substrate are heated from about 25 degrees Celsius to the first temperature at a first rate of about 0.01 degrees Celsius to about 4 degrees Celsius per second, and wherein the polyimide layer is maintained at the first temperature for a first period of time of about 10 minutes to about 60 minutes;
- and
- (b) adjusting the variable frequency microwave energy to increase a temperature of the polyimide layer and the substrate to a second temperature of about 300 to about 400 degrees Celsius to cure the polyimide layer, wherein the polyimide layer and the substrate are heated from the first temperature to the second temperature at a second rate of about 0.01 degrees Celsius to about 4 degrees Celsius per second, and wherein the polyimide layer is maintained at the second temperature for a second period of time of about 5 to about 60 minutes, and wherein (a)-(b) are performed within a microwave processing chamber under vacuum.
Dependencies are inferred from the claim text.