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US 2017/0365489 A1Published application
System and method for manufacturing a cavity down fabricated carrier
AssigneeEnablink Technologies Limited
InventorKa Wa CHEUNG
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Abstract
A method of fabricating a receptacle down BGA carrier having a top surface and a bottom surface, the method comprising combining a conductive portion and a molded dielectric portion, said dielectric portion having an inner surface intersecting said top surface, said inner surface forming a cavity for receiving a die; selectively etching part of said conductive portion; and applying solder resist to a portion of a top surface of said conductive portion.
Claims19
A method of fabricating a receptacle down BGA carrier having a top surface and a bottom surface, the method comprising:
- combining a conductive portion and a molded dielectric portion, the dielectric portion having an inner surface intersecting the top surface, the inner surface forming a cavity for receiving a die;
- selectively etching part of the conductive portion;
- and
- applying solder resist to a portion of a top surface of the conductive portion.
1 more element
Dependencies are inferred from the claim text.