Method for setting mounting position of target substrate and film forming system

A film forming system comprising:

• a film forming apparatus having a mounting table in a processing chamber;
• and
• a substrate transfer unit configured to transfer a target substrate to a mounting position set on the mounting table,
• wherein the film forming apparatus includes:
• a ring-shaped mask which covers a surface of an edge portion of the target substrate mounted on the mounting table and subjected to film formation to form a non-film formation region at the edge portion and has an opening corresponding to a film formation region formed at an inner side of the non-film formation region, the mask having an expected arrangement position where the non-film formation region has a preset width when the target substrate is mounted at a first position on the mounting table and subjected to the film formation;
• and
• a control unit configured to output a control signal for executing:
• transferring a test substrate by the substrate transfer unit to a second position on the mounting table which is set to be deviated from the first position by a preset distance in a preset direction;
• performing the film formation on the test substrate mounted at the second position by using the mask;
• measuring a width of the non-film formation region formed on the test substrate after the film formation;
• specifying an actual arrangement position of the mask based on the direction and the distance of the deviation of the second position from the first position and the measured width of the non-film formation region formed on the test substrate;
• and correcting the first position as the mounting position of the target substrate transferred by the substrate transfer unit such that the non-film formation region has the preset width based on the actual arrangement position of the mask.