Mask blank substrate, mask blank, and methods for manufacturing them, method for manufacturing transfer mask, and method for manufacturing semiconductor device
OwnerYohei IKEBE, Masaru TANABEinventors
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OwnerYohei IKEBE, Masaru TANABEinventors
Estimating the term…
The object is to provide a mask blank substrate, a mask blank, and a transfer mask which can achieve easy correction of a wavefront by a wavefront correction function of an exposure apparatus. The further object is to provide methods for manufacturing them. A virtual surface shape, which is an optically effective flat reference surface shape defined by a Zernike polynomial, is determined, wherein the Zernike polynomial is composed of only terms in which the order of variables related to a radius is second or lower order and includes one or more terms in which the order of the variables related to a radius is second-order; and the mask blank substrate, in which difference data (PV value) between the maximum value and the minimum value of difference shape between a virtual surface shape and a composite surface shape obtained by composing respective surface shapes of two main surfaces is 25 nm or less, is selected.
A mask blank substrate comprising a substrate having two opposite main surfaces,
A multi-layer reflective film coated substrate comprising:
A multi-layer reflective film coated substrate comprising
A mask blank comprising
A mask blank comprising a thin film for transfer pattern formation provided on the multi-layer reflective film of the multi-layer reflective film coated substrate, the substrate having two opposite main surfaces,
A mask blank comprising
A mask blank comprising
A method for manufacturing a transfer mask comprising
18-34. (canceled)
A method for manufacturing a semiconductor device comprising:
A mask blank comprising:
A method for manufacturing a transfer mask comprising:
A method for manufacturing a transfer mask comprising:
A method for manufacturing a transfer mask comprising:
A method for manufacturing a transfer mask comprising:
A method for manufacturing a semiconductor device comprising:
A method for manufacturing a semiconductor device comprising:
A method for manufacturing a semiconductor device comprising:
A method for manufacturing a semiconductor device comprising:
Dependencies are inferred from the claim text.