Printed circuit board assembly with a photonic integrated circuit for an electro-optical interface

A method of assembling a printed circuit board assembly for an electro-optical interface, the method comprising:

• mounting a photonic integrated circuit within a cavity defined by a printed circuit board such that a top surface of the photonic integrated circuit is disposed above a top surface of the printed circuit board, wherein the printed circuit board comprises conductive elements for transmitting electrical signals, and wherein the photonic integrated circuit comprises a layer of silica configured for transmitting optical signals;
• connecting an optoelectronic transducer to the photonic integrated circuit, wherein the optoelectronic transducer is configured to convert between the optical signals and the corresponding electrical signals;
• and
• securing an optical coupler to the optoelectronic transducer, wherein the optical coupler is supported by the photonic integrated circuit or the printed circuit board, and wherein the optical coupler is configured to transmit the optical signals between the optoelectronic transducer and an optical fiber,
• wherein electrical signals received via an input to the printed circuit board are transmitted via the conductive elements on the top surface of the printed circuit board and communicated to conductive elements on the top surface of the photonic integrated circuit, conducted into the optoelectronic transducer for conversion into corresponding optical signals, and transmitted into the optical fiber via the optical coupler, and
• wherein optical signals received through the optical fiber at the optical coupler are transmitted into the optoelectronic transducer, converted into corresponding electrical signals, and transmitted as electrical signals through the photonic integrated circuit via the conductive elements on the top surface of the photonic integrated circuit and communicated to the conductive elements on the top surface of the printed circuit board.