Multilayer laminated substrate
AssigneeToray Industries, Inc.
InventorsYukihiro Maeda, Masayuki Kitagawa, Masanobu Takeda
Life of this patent
Estimating the term…
Abstract
A multilayer laminated substrate is characterized in that at least a transparent resin substrate [A], a metal oxide layer [C], an electroconductive metal layer [D], a high refractive index metal oxide layer [E], and a protection layer [F] containing at least one of an inorganic oxide and an inorganic nitride are stacked in this order and the following (1) and (2) are satisfied: (1) a film thickness of the protection layer [F] is 5 nm to 300 nm; and (2) relative to a sum total of one or more metal elements, one or more semimetal elements, and one or more semiconductor elements contained in the protection layer [F], a content percentage by mass of carbon contained in the protection layer [F] is less than or equal to 50%.
Claims18
-7. (canceled)
A multilayer laminated substrate comprising:
- at least a transparent resin substrate [A],
- a metal oxide layer [C],
- an electroconductive metal layer [D],
- a high refractive index metal oxide layer [E], and
- a protection layer [F] containing at least one of an inorganic oxide and an inorganic nitride stacked in this order and (1) and (2) are satisfied:
- (1) film thickness of the protection layer [F] is 5 nm to 300 nm;
- and
- (2) relative to a sum total of one or more metal elements, one or more semimetal elements, and one or more semiconductor elements contained in the protection layer [F], a content percentage by mass of carbon contained in the protection layer [F] is less than or equal to 50%.
Dependencies are inferred from the claim text.