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US 2017/0363658 A1Published application
Probe Card Structure
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsMing-Cheng Hsu, Mj Wang
Life of this patent
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Abstract
A probe head and methods of testing a device using a probe head are provided. The probe head includes a first end connected to a first substrate. The first substrate is configured to be connected to a test head. The probe head also includes second end having a first inner recess surrounded by a first protrusion and a first plurality of probe needles connected to the first protrusion.
Claims20
A probe head, comprising:
- a first end connected to a first substrate, the first substrate configured to be connected to a test head;
- a second end comprising:
- a first inner recess surrounded by a first protrusion;
- and
- a first plurality of probe needles connected to the first protrusion.
2 more elements
A method, comprising:
- placing a wafer to be tested in a test area, the wafer including a top substrate bonded to a bottom substrate;
- and
- arranging a probe head over the wafer, the probe head comprising:
- a first end connected to a tester;
- a second end having a first protrusion arranged around a first inner recess and a first plurality of probe needles connected to the first protrusion;
- wherein the probe head is arranged in a manner that the first plurality of probe needles each respectively touch a contact on a surface of the wafer, and the top substrate is positioned in the first inner recess.
3 more elements
A method, comprising:
- placing a wafer to be tested in a test area, the wafer including a first top substrate and a second top substrate, the first top substrate and the second top substrate bonded to a bottom substrate;
- and
- arranging a probe head over the wafer, the probe head comprising:
- a first end connected to a tester;
- a second end comprising:
- a first protrusion arranged around a first inner recess and a first plurality of probe needles connected to the first protrusion;
- a second protrusion arranged around a second inner recess and a second plurality of probe needles connected to the second protrusion;
- wherein the probe head is arranged in a manner that the first plurality of probe needles each respectively touch a contact on a surface of the wafer, the second plurality of probe needles each respectively touch a contact on the surface of the wafer, the first top substrate is positioned in the first inner recess, and the second top substrate is positioned in the second inner recess.
5 more elements
Dependencies are inferred from the claim text.