Method and apparatus of inspecting a substrate with a component mounted thereon
AssigneeKoh Young Technology Inc.
InventorJoong-Ki JEONG
Life of this patent
Estimating the term…
Abstract
A method and an apparatus of inspecting a substrate with a component mounted thereon, which are capable of inspecting whether the component is properly mounted or not without additional setting or changing inspection condition, are provided. The method comprises measuring a three-dimensional shape by irradiating the pattern image toward the substrate through at least one illumination unit and by taking a reflected image through an imaging unit, extracting a shield region from the three-dimensional shape, and inspecting a component mounting defect in an area excluding the shield region in the three-dimensional shape.
Claims16
A method of inspecting a substrate with a component mounted thereon, comprising:
- measuring a three-dimensional shape by irradiating the pattern image toward the substrate through at least one illumination unit and by taking a reflected image through an imaging unit;
- extracting a shield region from the three-dimensional shape;
- and
- inspecting a component mounting defect in an area excluding the shield region in the three-dimensional shape.
A method of inspecting a substrate with a component mounted thereon, comprising:
- obtaining two-dimensional image through an image capturing unit;
- extracting a shield region by using the two-dimensional image;
- and
- inspecting a component mounting defect in an area excluding the shield region.
An apparatus of inspecting a substrate with a component mounted thereon, comprising:
- an image capturing unit capturing an image reflected from a measurement object;
- and
- a central control unit extracting a shield region from the image and inspecting a defect of a component in an area excluding the shield region.
(canceled)
Dependencies are inferred from the claim text.