Semiconductor sensor assembly for harsh media application

Method of manufacturing a semiconductor sensor assembly, comprising the steps of:

• providing a processing device comprising at least one first bondpad of a material which may be corroded by a corrosive component in a corrosive environment;
• providing a sensor device comprising at least one second bondpad, the second bondpad consisting of and/or being covered by a first corrosion resistant material;
• making a signal connection between the at least one first bondpad of the processing device and the at least one second bondpad of the sensor device by means of at least one bonding wire;
• partially overmoulding the processing device by a second corrosion resistant material, the processing device thus being partially exposed to a cavity in the second corrosion resistant material;
• mounting the sensor device in the cavity;
• and
• providing, before partially overmoulding the processing device, a redistribution layer to enable the signal connection between the processing device and the sensor device to be physically made in the cavity while the second corrosion resistant material covers the at least one first bondpad.