Thermopile test structure and methods employing same
AssigneeX-Fab Semiconductor Foundries AG
InventorsPeter HOFMANN, Kerst GRIESBACH, Monika REINHOLD
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Abstract
A semiconductor product comprising: a semiconductor substrate and a test structure, the test structure comprising: a thermopile and at least one temperature sensitive element, the at least one temperature sensitive element being located in the substrate, or between the substrate and the thermopile.
Claims37
A semiconductor product comprising:
- a semiconductor substrate;
- and
- a test structure comprising:
- a thermopile and at least two temperature sensitive elements, the at least two temperature sensitive elements being located in the substrate, or between the substrate and the thermopile,
- wherein one temperature sensitive element is located proximate a central portion of the thermopile and another temperature sensitive element is located proximate an outer portion of the thermopile.
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A method of manufacturing a semiconductor product comprising:
- providing a semiconductor substrate;
- forming at least one temperature sensitive element at least partially within the substrate;
- forming a thermopile structure in one or more conductive layers above the substrate;
- and testing the thermopile prior to or without reducing the thickness of the substrate.
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A method for use in conjunction with a wafer formed of a semiconductor substrate, the wafer comprising:
- at least one first structure having a thermopile;
- and
- at least one second structure, distinct from the first structure, having a thermopile and a temperature sensitive element disposed at least partially within the substrate, the method comprising:
- assessing the quality of the first structure by performing a test on the second structure.
Dependencies are inferred from the claim text.