Interface-Free Thermal Management System for High Power Devices Co-Fabricated with Electronic Circuit

A thermal-interface-material (TIM)-free thermal management apparatus, comprising:

• a thermally-conductive unitary structure having an integrated circuit (IC) side and cooling system side, the thermally-conductive unitary structure comprising:
• a plurality of high aspect ratio micro-pillars or porous structures extending from the IC side;
• and
• a cooling system extending from the cooling system side, the cooling system selected from the group consisting of:
• a vapor chamber, micro-channel cooler, jet-impingement chamber, and air-cooled heat sink;
• wherein the cooling system and the plurality of high aspect ratio micro-pillars form part of the same homogenous and thermally-conductive unitary structure.

An apparatus, comprising:

• an integrated and unitary body of homogenous material having:
• an integrated circuit (IC) layer;
• a first heat exchange layer in thermal communication with the integrated circuit layer, the first heat exchange layer selected from the group consisting of:
• a vapor chamber, micro-channel cooler, jet-impingement cooler, and air-cooled heat sink;
• and
• a second heat exchange layer in thermal communication with the first heat exchange layer, the second heat exchange layer selected from the group consisting of fins and tabs.