Self-adjusting cooling module

A method for cooling an electronic device, the method comprising:

• mounting between the electronic device and a heat sink a cooling apparatus, which comprises:
• a first wedge having a first flat surface and a first diagonal surface, wherein the first flat surface is coupled to the electronic device;
• a second wedge having a second flat surface and a second diagonal surface, wherein the second diagonal surface faces the first diagonal surface of the first wedge, and the second flat surface is coupled to the heat sink;
• a solid thermal interface material (TIM) disposed between the first and second diagonal surfaces;
• and
• a flexible force-exerting element for moving the first wedge or the second wedge, so as to slide the first diagonal surface or the second diagonal surface on the TIM and push the second flat surface against the heat sink;
• operating the electronic device;
• and
• conducting heat generated by the electronic device via the cooling apparatus to the heat sink.

A method for producing a cooling apparatus, the method comprising:

• providing a first wedge having a first flat surface and a first diagonal surface, for coupling the first flat surface to an electronic device;
• providing a second wedge having a second flat surface and a second diagonal surface, and positioning the second diagonal surface to face the first diagonal surface of the first wedge, for coupling the second flat surface to a heat sink;
• disposing a solid thermal interface material (TIM) between the first and second diagonal surfaces;
• and
• coupling a flexible force-exerting element to at least the first wedge or the second wedge, so as to slide the first diagonal surface or the second diagonal surface on the TIM and pushing the second flat surface against the heat sink.