Heat dissipation device
AssigneeTai-Sol Electronics Co., Ltd.
InventorsYun-Yeu YEH, Chuan-Chi TSENG, Ming-Quan CUI
Life of this patent
Estimating the term…
Loading patent…
AssigneeTai-Sol Electronics Co., Ltd.
InventorsYun-Yeu YEH, Chuan-Chi TSENG, Ming-Quan CUI
Estimating the term…
A heat dissipation device includes: a heat spreader having a first plate and a second plate, wherein the plates are connected to form a receiving space therebetween; a first capillary material provided on the first plate, the second plate, or both; at least one heat pipe having a cavity in communication with the receiving space, wherein the heat pipe is connected to the heat spreader at one end and is outside the heat spreader and closed at the other end; a second capillary material provided on the inner wall of the heat pipe; at least one fiber bundle of an elongated shape, wherein the fiber bundle has a portion in the receiving space and in contact with the first capillary material and another portion extending into the cavity and in contact with the second capillary material; and a working fluid in the receiving space and the cavity.
A heat dissipation device, comprising:
Dependencies are inferred from the claim text.