Cooling device
AssigneesKabushiki Kaisha Toshiba, Toshiba Infrastructure Systems & Solutions Corporation
InventorsKensuke Aoki, Takuya Hongo
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AssigneesKabushiki Kaisha Toshiba, Toshiba Infrastructure Systems & Solutions Corporation
InventorsKensuke Aoki, Takuya Hongo
Estimating the term…
A cooling device of an embodiment includes an evaporator, a condenser, a first connection pipe, a second connection pipe, and a third connection pipe. A refrigerant is vaporized in the evaporator by heat generated by a heating element. The condenser is located above the evaporator, and configured to condense the vaporized refrigerant by exchanging heat with an external fluid. The first connection pipe guides the refrigerant vaporized by the evaporator to the condenser. The second connection pipe guides the refrigerant condensed by the condenser to the evaporator. The third connection pipe connects a portion of the first connection pipe and a portion of the second connection pipe. A connection position between the third connection pipe and the first connection pipe is higher than a maximum liquid level height of the refrigerant in the second connection pipe during an operation.
A cooling device comprising:
Dependencies are inferred from the claim text.