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US 2017/0362733 A1Published application
Copper foil with release layer, laminated material, method for producing printed wiring board, and method for producing electronic apparatus
AssigneeJX Nippon Mining & Metals Corporation
InventorMICHIYA KOHIKI
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Abstract
A copper foil with a release layer is provided that capable of forming a circuit, of such as an embedded trace substrate, by a subtractive method in a simple process. A copper foil with a release layer, containing, in this order, a release layer; a barrier layer having dissolution resistance to a copper etchant; and a copper foil.
Claims19
A copper foil with a release layer, comprising, in this order, a release layer;
- a barrier layer having dissolution resistance to a copper etchant;
- and a copper foil.
Dependencies are inferred from the claim text.