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US 2017/0362428 A1Published application
Epoxy resin composition
AssigneeShin-Etsu Chemical Co., Ltd.
InventorsNaoyuki KUSHIHARA, Kazuaki SUMITA
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Abstract
Provided is an epoxy resin composition exhibiting an unimpaired adhesion force by employing a particular acrylic resin that is highly compatible with epoxy resins. The epoxy resin composition of the invention contains (A) an epoxy resin; (B) an epoxy resin curing agent; and (C) a liquid acrylic resin, wherein the liquid acrylic resin (C) exhibits a weight-average molecular weight (Mw) of 2,000 to 20,000, a reactive functional group equivalent of 400 to 10,000 g/eq per one molecule, and a solvent content of not higher than 1% by mass.
Claims8
An epoxy resin composition comprising:
- (A) an epoxy resin;
- (B) an epoxy resin curing agent;
- and
- (C) a liquid acrylic resin, wherein
- said liquid acrylic resin (C) exhibits a weight-average molecular weight (Mw) of 2,000 to 20,000, a reactive functional group equivalent of 400 to 10,000 g/eq per one molecule, and a solvent content of not higher than 1% by mass.
2 more elements
Dependencies are inferred from the claim text.