Ceramic substrate, bonded body, module, and method for manufacturing ceramic substrate
AssigneeMitsubishi Electric Corporation
InventorsNobuaki KONNO, Yoshiaki HIRATA
Life of this patent
Estimating the term…
Abstract
A ceramic substrate is mainly constituted of ceramic, and has a first main surface and a second main surface located opposite to the first main surface. A recessed portion recessed toward a first main surface side is formed in the second main surface. A wire portion extending from an outer peripheral surface of the ceramic substrate to inside of the recessed portion is formed, and a bottom portion located on the first main surface side in the recessed portion has a portion thinner than another portion of the ceramic substrate other than the bottom portion.
Claims11
A ceramic substrate mainly constituted of ceramic and having a first main surface and a second main surface located opposite to the first main surface, wherein
- a recessed portion recessed toward a first main surface side is formed in the second main surface,
- a wire portion extending from an outer peripheral surface of the ceramic substrate to inside of the recessed portion is formed, and
- a bottom portion located on the first main surface side in the recessed portion has a diaphragm which is a portion thinner than another portion of the ceramic substrate other than the bottom portion,
- the diaphragm is configured to have flexibility to deform when the inside of the recessed portion is airtightly sealed and a pressure difference is formed between the airtightly sealed inside of the recessed portion and an external space of the ceramic substrate.
(canceled)
A method for manufacturing a ceramic substrate, comprising:
- preparing a plurality of ceramic base materials mainly constituted of ceramic;
- stacking and firing the plurality of ceramic base materials;
- and
- forming a recessed portion in a stacked body obtained by the firing, wherein
- in the preparing, a first electrically conductive portion is formed in a portion of the plurality of ceramic base materials, and a second electrically conductive portion and a through hole are formed in a remaining ceramic base material of the plurality of ceramic base materials,
- the firing includes stacking the plurality of ceramic base materials such that the first electrically conductive portion is connected with the second electrically conductive portion, and simultaneously firing the stacked plurality of ceramic base materials at a temperature of less than or equal to 1000° C. while applying a pressure thereto, and
- in the forming the recessed portion, the recessed portion is formed by etching a surface exposed within the through hole in the stacked body.
Dependencies are inferred from the claim text.