Method of manufacturing semiconductor chips for liquid discharge head

A method of manufacturing a plurality of semiconductor chips for a liquid discharge head from a substrate by cutting the substrate along intended cutting portions of a linear form, the substrate including a plurality of energy generating elements configured to generate energy used for discharging liquid, a plurality of liquid flow paths through which the liquid is supplied to the energy generating elements, a plurality of discharge ports through which the liquid is discharged, a first surface on which the energy generating elements are disposed, and a second surface which is a rear surface of the first surface, the method comprising:

• forming trenches of a linear form through etching from the second surface along the intended cutting portions;
• forming modified portions in the substrate by irradiating a laser beam from the first surface side along the intended cutting portions;
• and
• splitting the substrate into the plurality of semiconductor chips for a liquid discharge head, by cutting the substrate with stress applied to the modified portions,
• wherein the intended cutting portions include inclined portions extending in a direction inclined with respect to a crystal orientation plane of the substrate and uninclined portions extending in a direction along the crystal orientation plane of the substrate, and
• wherein the trenches are formed at least along the inclined portions.