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US 2017/0361494 A1Published application
Wire sawing apparatus
AssigneeLG Siltron Inc.
InventorsJi Won JEON, Sang Min AN
Life of this patent
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Abstract
A wire sawing apparatus of one embodiment comprises: a wire for cutting an ingot; an ingot conveyor unit for conveying the ingot to the wire; a nozzle for supplying slurry to the wire; and a dispersed slurry blocking unit disposed above the ingot sawed by the wire, so as to absorb at least a part of the slurry dispersed from the lateral sides of the ingot cut by the wire.
Claims20
A wire sawing apparatus, comprising:
- a wire configured to cut an ingot;
- an ingot conveyor unit configured to convey the ingot to the wire;
- a nozzle configured to supply slurry to the wire;
- and
- a dispersed slurry blocking unit disposed above and beside the ingot that is sewn by the wire and configured to absorb at least some of the slurry dispersed from a lateral surface of the ingot that is cut by the wire, the dispersed slurry blocking unit including a rnesh structure that absorbs the dispersed slurry.
2 more elements
Dependencies are inferred from the claim text.