Laser beam machine and alignment adjusting method
AssigneeMakino Milling Machine Co., Ltd.
InventorsHiroshi TOYAMA, Muneaki BEPPU
Life of this patent
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Abstract
This laser processing machine, which moves a work piece, which is mounted on a table, and an optical head, which shines a laser light, relative to each other, and processes the work piece by irradiating the work piece with the laser light, is provided with: a calibration camera that is fixed to the optical head; a probe that is fixed to the optical head; and a calibration unit that has measurement reference points (Pc1, Pc2, Pc3, Pp1, Pp2, Pp3) for measuring the position of the calibration camera and the probe, and a processing portion that forms a processing mark (L1, L2) due to the laser light.
Claims5
A laser beam machine configured to move a workpiece mounted to a table and an optical head for irradiating a laser beam to the workpiece, whereby machining the workpiece, characterized by:
- an optical sensor secured to the optical head;
- a probe secured to the optical head;
- and
- a calibration unit having a measurement reference for measuring positions by the optical sensor and the probe, and a to-be-processed part adapted to form a machined mark by the laser beam.
A laser machining method for machining a workpiece by moving a workpiece attached to a table and an optical head configured to irradiate laser beam relatively to each other, and irradiating the laser beam to the workpiece, characterized by:
- providing a calibration unit secured to the table and having a measurement reference and a to-be-processed part;
- forming a machined mark with the laser beam on the to-be-processed part of the calibration unit;
- measuring, by an optical sensor mounted to the optical head, the position of the machined mark on the to-be-processed part and the position of the measurement reference of the calibration unit;
- measuring the position of the measurement reference by a probe mounted to the optical head;
- calculating the deviation between the position of the machining point of the laser beam and the position measured by the probe, based on the position of the machined mark and the position of the measurement reference, measured by the optical sensor, and the position of the measurement reference measured by the probe;
- obtaining the relative position between the workpiece and the machining point of the laser beam, based on the calculated deviation between the machining point of the laser beam and the position measured by the probe, and the position of the workpiece measured by the probe;
- and
- machining the workpiece by moving the table and the optical head relatively to each other, based on the obtained relative position between the workpiece and the machining point of the laser beam.
Dependencies are inferred from the claim text.