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US 2017/0361390 A1Published application
Interconnect alloy material and methods
AssigneeIntel Corporation
InventorsTing Zhong, Rajashree Raji Baskaran, Aleksandar Aleksov
Life of this patent
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Abstract
A solder and methods of forming an electrical interconnection are shown. Examples of solders include gallium based solders. A solder including gallium is shown that includes particles of other solders mixed with a gallium based matrix. Methods of applying a solder are shown that include swiping a solder material over a surface that includes a resist pattern. Methods of applying a solder are also shown that include applying a solder that is immersed in an acid solution that provides a fluxing function to aid in solder adhesion.
Claims14
A method, comprising:
- forming a resist pattern surrounding an exposed electrical contact;
- placing a gallium based solder over the resist pattern and the electrical contact;
- reflowing the gallium based solder on the electrical contact;
- and
- removing the resist pattern.
2 more elements
A method, comprising:
- spreading a liquid gallium based solder suspended in an acid solution across an electrical contact;
- removing an oxide on an exposed surface of the electrical contact using the acid solution;
- and
- depositing a ball of liquid gallium based solder on the electrical contact as the a liquid gallium based solder suspended in an acid solution passes over the electrical contact.
1 more element
Dependencies are inferred from the claim text.