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US 2017/0355058 A1Published application
Multiphase Cutting
OwnerArshak Isajanyaninventor
Life of this patent
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Abstract
Multiphase Cutting may comprise a bulk removal pass followed by a fine removal pass to cut a gemstone. For example, multiphase cutting may perform a removal by removing approximately 90% of material during a first pass and then reset and remove the remaining 10% of material during a second pass. The second pass may use a slower feed rate and a wider oscillation, moving the gemstone across an entire range of a lap wheel. This split setup may thus produce significantly more accurate results for the accuracy of the total removal.
Claims3
A method of cutting a gemstone, comprising:
- removing a majority of material from a stone using a first feed rate and a first oscillation setting;
- and
- removing a remaining material from the stone using a second feed rate and a second oscillation setting, the second feed rate being lower than the first feed rate, and the second oscillation setting giving a larger oscillation than the first oscillation setting.
Dependencies are inferred from the claim text.