Method for evaluating abrasive grains, and method for manufacturing silicon wafer
AssigneeSumco Corporation
InventorYuuji MINAMIHATA
Life of this patent
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Abstract
An evaluation method of abrasive grains used in an ingot-cutting slurry includes: an evaluation solution preparation step in which abrasive grains including polishing grains and impurities are dissolved in a solvent to prepare an evaluation solution; a sedimentation step in which a container containing the evaluation solution is left still to settle the polishing grains; a measurement step in which a turbidity of supernatant of the evaluation solution is measured using the measurement device; and an estimation step in which an amount of the impurities is estimated based on the measurement result of the turbidity of the supernatant.
Claims6
An evaluation method of abrasive grains usable for an ingot-cutting slurry, the evaluation method comprising:
- preparing an evaluation solution by dissolving abrasive grains comprising polishing grains and impurities in a solvent;
- settling the polishing grains by leaving still a container containing the evaluation solution;
- measuring a turbidity of a supernatant of the evaluation solution using a measurement device;
- and
- estimating an amount of the impurities based on measurement results of the turbidity of the supernatant.
Dependencies are inferred from the claim text.