Package structure of display panel, connecting board, package method and display device
AssigneeBoe Technology Group Co., Ltd.
InventorBo ZHANG
Life of this patent
Estimating the term…
Abstract
Provided are a package structure, adaptor board, and packaging method of a display panel, and display device. A package structure of a display panel includes: the display panel, a chipset configured to control the display panel, and an adaptor board, wherein the chipset is located over the display panel, and the adaptor board is located between the chipset and the display panel. A protrusion at a side of the adaptor board facing the display panel has a gold surface. Package pins of respective chips in the chipset are electrically connected to the display panel via the adaptor board.
Claims18
A package structure of a display panel, comprising:
- a display panel, a chipset configured for controlling the display panel, and a connecting board, wherein
- the chipset is located above the display panel, and the connecting board is located between the chipset and the display panel;
- a surface of a convex spot on a side of the connecting board facing the display panel is of gold;
- package pins of respective chips in the chipset are electrically connected with the display panel through the connecting board.
A connecting board, wherein, a surface of a convex spot on at least one side of the connecting board is of gold.
A package method of a display panel, comprising:
- electrically connecting a first side of an connecting board with package pins of respective chips in a chipset configured for controlling the display panel, by a reflow soldering process;
- and
- electrically connecting a second side of the connecting board with the display panel by a chip on glass packaging process, wherein, a surface of a convex spot on the second side of the connecting board is of gold.
Dependencies are inferred from the claim text.