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US 2017/0330996 A1Published application
Semiconductor chip and method for producing a semiconductor chip
AssigneeOSRAM Opto Semiconductors GmbH
InventorsAlfred LELL, Andreas LOEFFLER, Christoph EICHLER, Bernhard STOJETZ, Andre SOMERS
Life of this patent
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Abstract
A semiconductor chip (100) is provided, having a first semiconductor layer (1), which has a lateral variation of a material composition along at least one direction of extent. Additionally provided is a method for producing a semiconductor chip (100).
Claims16
Semiconductor chip, having a first semiconductor layer, which has a lateral variation of a material composition along at least one direction of extent, wherein the first semiconductor layer has a constant thickness.
Dependencies are inferred from the claim text.