Circuit shielding structure

A circuit shielding structure, comprising a substrate, wherein:

• a radio frequency component circuit is fixed on the substrate;
• a wave-absorbing material layer is embedded in the substrate;
• a shielding wall, which is made of wave-absorbing material, is arranged on the substrate and around the radio frequency component circuit;
• a conductive material layer covers the shielding wall;
• a closed space is formed among the substrate in which the wave-absorbing material layer is embedded, the shielding wall and the conductive material layer;
• and the radio frequency component circuit is sealed in the closed space, so that omnidirectional shielding is achieved;
• the circuit shielding structure further comprises a ground layer, wherein:
• the ground layer is arranged on the shielding wall;
• an upper end of the ground layer is connected to the conductive material layer;
• a ground terminal is arranged at a lower end of the ground layer, and the ground terminal is connected to the substrate, so that through grounding by the ground terminal on the substrate, zero-potential shielding of the conductive material layer is realized;
• the ground layer is made of conductive foam material or conductive rubber material;
• the ground layer has compressibility for strengthening grounding between the ground layer and the substrate;
• a circuit board serves as the substrate;
• the circuit board holds the radio frequency component circuit, and the wave-absorbing material layer is embedded in the circuit board, which saves a cost of the wave-absorbing material layer and realizes the omnidirectional shielding;
• the radio frequency component circuit comprises an integrated chip, wherein:
• the integrated chip comprises a sealed housing made of plastic;
• a containing chamber for containing liquid metal is arranged at an upper part of the sealed housing and serves as a heat dispersion window;
• a heat dispersion device made of steel is arranged at an upper part of the containing chamber;
• at least five needle-shaped protruding parts, which protrude upwardly, are arranged on the heat dispersion device;
• and the heat dispersion device covers the containing chamber;
• a lower part of the heat dispersion device is connected with a sheet-shaped object which is inserted into the liquid metal and exchanges heat with the liquid metal, and the sheet-shaped object is made of steel;
• and
• the liquid metal is gallium alloy.