US 2017/0325356 A1 · ULTRATHIN HEAT DISSIPATION STRUCTURE AND A METHOD FOR MANUFACTURING SAME

Abstract

An ultrathin heat dissipation structure includes a copper clad sheet, a cover, a number of bond blocks, and a phase-change material. The copper clad sheet is given containing grooves and a number of ribs round each containing groove. The containing grooves are formed by stamping. The copper clad sheet includes an insulation layer. The copper clad layer is inner surface of the containing groove. The bond blocks are arranged on the ribs and cover is pressed to the stamped copper clad sheet and secured using the bond blocks. The containing grooves form sealing cavities and the phase-change material in the sealed cavity gathers and transfers out any heat generated by components.

Claims20

Dependent claims

An ultrathin heat dissipation structure comprising:

a copper clad sheet comprising a plurality of containing grooves and a plurality of ribs round each containing groove, the containing groove is formed by stamping, the copper clad sheet comprising an insulation layer and a copper clad layer attached on the insulation layer, the copper clad layer is an inner surface of the containing grooves;
a plurality of bond blocks arranging on the ribs;
a cover being fixed on the copper clad sheet with the containing groove using the bond blocks, the cover sealing the containing grooves to form a plurality of a sealed cavities;
and
a phase-change material being received in the sealed cavity gathering and transferring out heat generated by components.

2 more elements

Dependencies are inferred from the claim text.

Facts

Application

15/191,550Filed 24 Jun 2016

Priority

CN 201610302508.69 May 2016

Published

9 Nov 2017

Term ends

Not estimatedThe source records don’t support an estimate.

Classification11 codes

H10W 40/255
Characterised by their materials: having a laminate or multilayered structure, e.g. direct bond copper [DBC] ceramic substrates
B21D 39/00
Application of procedures in order to connect objects or parts
H05K 7/2029
Modifications to facilitate cooling, ventilating, or heating: using a liquid coolant with phase change in electronic enclosures
H05K 7/2039
Modifications to facilitate cooling, ventilating, or heating: characterised by the heat transfer by conduction from the heat generating element to…

Ultrathin heat dissipation structure and a method for manufacturing same

Life of this patent

Ultrathin heat dissipation structure and a method for manufacturing same

Life of this patent

Abstract

Claims20