Structure, electronic device incuding the same, and method of manufacturing structure

A method of manufacturing a structure comprising:

• a first step of preparing a first member and a second member, the second member including a first surface and a second surface which face opposite to each other and including a through hole;
• a second step of inserting the first member in the through hole;
• a third step of injecting a sealant into a portion including the through hole after the second step;
• and
• a fourth step of sealing the through hole while the first member and the second member are fixed relatively to each other by curing the sealant injected in the third step,
• the second member including a space which opens into the second surface adjacently to the through hole on the side of the second surface,
• the first member including a pass-through portion which passes through the space and the through hole,
• the space including
• a first region hidden by the pass-through portion and a portion which extends along the second surface on a side of the second surface of the first member,
• a second region located opposite to the first region with the pass-through portion being interposed, and
• a third region which lies from one main surface of the pass-through portion to the other main surface of the pass-through portion while the third region is in contact with both of the first region and the second region,
• the second member including a groove continuing to the first region,
• in the third step, the sealant being injected into the first region along the groove by applying a tip end of an instrument for injecting the sealant to the groove, and
• in the third step, the sealant injected into the first region being located to surround the pass-through portion as the sealant moves from the first region via the third region to the second region.