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AssigneeTatsuta Electric Wire & Cable Co., Ltd.
InventorsYoshihiko AOYAGI, Yoshinori KAWAKAMI, Yoshio HIRANO, Kiyotaka URASHITA, Ryota FUJIKAWA, Nobuhiro FUJIO
Estimating the term…
Soldering is performed with a high yield ratio even when extremely-thin wires are joined at an extremely-narrow pitch. Moreover, a bridge between conductive joint portions is reduced. A core wire 41 is placed on a preliminarily-soldered conductive joint portion 2. Then, the conductive joint portions 2 and the core wires 41 are covered with an optically-transparent sheet 30. Thus, the state in which the core wire 41 is placed on the conductive joint portion 2 is held. In this state, the optically-transparent sheet 30 is irradiated with light. A preliminary solder 3 is heated and melted to join the core wire 41 and the conductive joint portion 2 together.
A method for joining a conductive member, comprising:
A method for manufacturing a printed circuit board, comprising:
-6. (canceled)
Dependencies are inferred from the claim text.