Circuit module such as a high-density lead frame array power module, and method of making same

The method of claim 6, further comprising attaching bond wires between bonding pads on selected electronic components.

A method of fabricating a circuit module, comprising:

• providing a plurality of electronic components;
• and
• providing a single-layer conductive package substrate so as to physically support and electrically interconnect the electronic components, the single-layer conductive package substrate having a peripheral portion and an interior portion, the peripheral portion including a plurality of peripheral contact pads coupled to corresponding electronic components and the interior portion including at least one floating contact pad coupled to corresponding electronic components, the single-layer conductive package substrate physically isolating the at least one floating contact pad from all peripheral contact pads, wherein the at least one floating contact pad is isolated from the peripheral contact pads by through at least one trench formed in and entirely through the single-layer conductive package substrate, the at least one trench being filled with an insulating encapsulation material.

A method of fabricating a power module, comprising:

• providing a plurality of electronic components including, a controller, at least one inductor, a plurality of power switching devices, and a plurality of resistive and capacitive elements;
• and
• providing a single-layer conductive package substrate having an upper surface so as to physically support the electronic components only on the upper surface, and to electrically interconnect the electronic components, the single0layer conductive package substrate having a peripheral portion and an interior portion, the peripheral portion including a plurality of peripheral contact pads coupled to corresponding electronic components, and the interior portion including at least one floating contact pad, the single-layer conductive package substrate physically isolating each floating contact pad from all peripheral contact pads, each floating contact pad being coupled to corresponding electronic components, wherein each floating contact pad is isolated from the peripheral contact pads by through at least one trench formed in the single-layer conductive package substrate, the at least one trench being filled with an insulating encapsulation material, no portion of the single-layer conductive package substrate extending over, under, or through the at least one trench.