Packaged semiconductor device having a shielding against electromagnetic interference and manufacturing process thereof
AssigneeSTMicroelectronics S.r.l.
InventorFederico Giovanni Ziglioli
Life of this patent
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Abstract
A packaged device has a die of semiconductor material bonded to a support. An electromagnetic shielding structure surrounds the die and is formed by a grid structure of conductive material extending into the support and an electromagnetic shield, coupled together. A packaging mass embeds both the die and the electromagnetic shield. The electromagnetic shield is formed by a plurality of metal ribbon sections overlying the die and embedded in the packaging mass. Each metal ribbon section has a thickness-to-width ratio between approximately 1:2 and approximately 1:50.
Claims20
A device comprising:
- an interference shield that includes:
- a base;
- a first vertical region coupled to the base;
- a second vertical region coupled to the base;
- and
- a ribbon section coupled to the first vertical region at a first end and coupled to the second vertical region at a second end, the ribbon section having a curvature;
- and
- a semiconductor die enclosed by the interference shield, the semiconductor die between the base and the ribbon section and a portion of the semiconductor die between the first vertical region and the second vertical region.
A method, comprising:
- forming a support that includes a shielding structure, the support having a recess;
- positioning a first semiconductor die in the recess;
- and
- coupling a shielding ribbon of the electromagnetic shield to the shielding structure, the shielding ribbon having a first length of shielding material between a first end and a second end, the first end and the second end coupled to the shielding structure at a first side of the shielding structure and the second end coupled to the shielding structure at a second side of the shielding structure, the first length greater than a distance between the first side and the second side of the shielding structure.
A device, comprising:
- a support including a recess, a conductive grid in the support and around the recess, a surface of the grid being exposed at a surface of the support;
- a semiconductor die in the recess and coupled to the support;
- and
- a shielding ribbon coupled to the surface of the grid that is exposed at the surface of the support, the shielding ribbon having a length this is greater than a length of the surface of the grid at the surface of the support, the shielding ribbon and the grid forming an electromagnetic shield.
Dependencies are inferred from the claim text.