Printed circuit board for high power components

A thermally-managed electronics system for high power components, comprising:

• a printed circuit board comprising:
• a first dielectric layer having a first exterior surface and a first interior surface opposite the first exterior surface, the first dielectric layer having at least one electrical component mounted to the first exterior surface, having a plurality of electrically-conductive traces on at least one of the first exterior and first interior surfaces, and having a plurality of thermal vias extending between the first exterior surface and the first interior surface;
• an embedded layer having a first embedded surface adjacent to the first interior surface of the first dielectric layer and a second embedded surface opposite the first embedded surface, the embedded layer comprising a thermally-conductive material having at least one coolant channel having a coolant channel inlet and a coolant channel outlet, the at least one coolant channel disposed between the first and second embedded surfaces;
• and
• a second dielectric layer having a second interior surface adjacent to the second embedded surface of the embedded layer and having a second exterior surface opposite the second interior surface;
• and
• a cooling system in fluidic communication with the embedded layer and configured to generate a flow of coolant from the coolant channel inlet to the coolant channel outlet.