Multiple Band Multiple Mode Transceiver Front End Flip-Chip Architecture and Circuitry with Integrated Power Amplifiers

An integrated circuit architecture defined by a die structure with a plurality of exposed conductive pads arranged in a grid of rows and columns, the integrated circuit architecture comprising:

• a first operating frequency region of the die structure including a first transmit chain with at least one first operating frequency power amplifier and a first receive chain including at least one first operating frequency low noise amplifier;
• a second operating frequency region of the die structure including a second transmit chain with at least one second operating frequency power amplifier and a second receive chain including at least one second operating frequency low noise amplifier;
• and
• a shared region of the die structure defined by an overlapping segment of the first operating frequency region and the second operating frequency region, the shared region including at least one of a shared power input conductive pad connected to the first transmit chain, the second transmit chain, the first receive chain, and the second receive chain, and a shared power detection output conductive pad connected to the first transmit chain and the second transmit chain.