Bridge leg circuit assembly and full-bridge circuit assembly

A packaging assembly of a full-bridge circuit, comprising:

• a circuit board, comprising:
• an insulating board have a first side and a second side,
• a first conducting layer on the first side of the insulating board, and
• a second conducting layer on the second side of the insulating board and comprising a first conducting area, a second conducting area and a third conducting area which are insulated from each other;
• a first active switch bare die comprising a first side and a second side which are opposite to each other, wherein the first active switch bare die is embedded in the circuit board with the first side of the first active switch bare die facing to and coupled with the first conducting area of the second conducting layer, and the second side of the first active switch bare die coupled with the second conducting area of the second conducting layer;
• a second active switch bare die comprising a first side and a second side which are opposite to each other, wherein the second active switch bare die is embedded in the circuit board with the first side of the second active switch bare die facing to and coupled with the second conducting area of the second conducting layer, and the second side of the second active switch bare die coupled with the first conducting layer;
• a third active switch bare die comprising a first side and a second side which are opposite to each other, wherein the third active switch bare die is embedded in the circuit board with the first side of the third active switch bare die facing to and coupled with the first conducting area of the second conducting layer, and the second side of the third active switch bare die coupled with the third conducting area of the second conducting layer;
• and
• a fourth active switch bare die comprising a first side and a second side which are opposite to each other, wherein the fourth active switch bare die is embedded in the circuit board with the first side of the fourth active switch bare die facing to and coupled with the third conducting area of the second conducting layer, and the second side of the fourth active switch bare die coupled with the first conducting layer.