Shielded radio frequency component with integrated antenna
AssigneeSkyworks Solutions, Inc.
InventorGeorge Khoury
Life of this patent
Estimating the term…
Abstract
Aspects of this disclosure relate to a shielded radio frequency component with an integrated antenna. An antenna can be on a first side of a multi-layer substrate and a radio frequency component can be disposed on a second side of the multi-layer substrate such that a ground plane of the multi-layer substrate is positioned between the antenna and the radio frequency component. Conductive features can be disposed around the radio frequency component and electrically connected to the ground plane. The conductive features and the ground plane can provide shielding for the radio frequency component. In certain embodiments, the conductive features can include bumps, such as solder bumps and/or copper pillars.
Claims20
A radio frequency module comprising:
- a multi-layer substrate having a first side and a second side opposite to the first side, the multi-layer substrate including a ground plane;
- an antenna on the first side of the multi-layer substrate;
- a radio frequency component disposed on the second side of the multi-layer substrate such that the ground plane is positioned between the antenna and the radio frequency component;
- and
- conductive features disposed around the radio frequency component and electrically connected to the ground plane, the conductive features and the ground plane configured to provide shielding for the radio frequency component.
A radio frequency circuit assembly comprising:
- a laminate substrate having a first side and a second side opposite to the first side, the laminate substrate including a ground plane;
- a printed antenna on the first side of the laminate substrate;
- a radio frequency component attached on the second side of the laminate substrate such that the ground plane is positioned between the printed antenna and the radio frequency component;
- and
- bumps disposed around the radio frequency component, the bumps being electrically connected to the ground plane such that the bumps and the ground plane form at least a portion of a shielding structure around the radio frequency component.
A system board assembly comprising:
- a laminate substrate having a first side and a second side opposite to the first side, the laminate substrate including a ground plane;
- a printed antenna on the first side of the laminate substrate;
- a radio frequency component attached on the second side of the laminate substrate such that the ground plane is positioned between the printed antenna and the radio frequency component;
- bumps disposed around the radio frequency component and being electrically connected to the ground plane;
- and
- a system board including ground pads electrically connected to the ground plane by way of the bumps such that a shielding structure is formed around the radio frequency component.
Dependencies are inferred from the claim text.