Microwave antenna apparatus, packing and manufacturing method

A microwave antenna apparatus comprising:

• a redistribution layer comprising a carrier layer, a ground plane arranged on a first or second surface of the carrier layer, and a microstrip line arranged on the other one of the first or second surface of the carrier layer;
• a semiconductor element mounted on the first surface of the carrier layer and coupled to the ground plane and the microstrip line;
• a mold layer covering the semiconductor element and the first surface of the carrier layer;
• and
• a waveguide arranged within the mold layer and on the first surface of the carrier layer and coupled to the semiconductor element by the microstrip line, wherein a solid state filling material is arranged within the waveguide.

A microwave antenna apparatus comprising:

• a redistribution layer comprising a carrier layer, a microstrip line arranged on a first surface of the carrier layer and a ground plane arranged on second surface of the carrier layer opposite the first surface;
• a semiconductor element mounted on the first surface of the carrier layer and coupled to the ground plane and the microstrip line;
• a mold layer covering the semiconductor element and the first surface of the carrier layer;
• and
• a resonator unit arranged within the mold layer and on the first surface of the carrier layer, wherein the resonator unit comprises a substrate element, made of quartz glass, PTFE, LCP or ceramic, coupled to the microstrip line and a resonator element mounted on a surface of the substrate element facing away from the first surface of the carrier layer.

A microwave antenna package comprising:

• a PCB arrangement comprising a PCB layer carrying a first contact layer on a first surface and a second contact layer on a second surface opposite the first surface, wherein said contact layers are coupled by coupling elements arranged within the PCB layer, wherein a transmission area of the PCB layer is arranged between coupling elements and is free from the contact layer;
• and
• a microwave antenna apparatus coupled to the PCB arrangement forming an embedded wafer-level ball grid array, said microwave antenna element comprising:
• a redistribution layer comprising a carrier layer, a ground plane arranged on a first or second surface of the carrier layer, and a microstrip line arranged on the other one of the first or second surface of the carrier layer;
• a semiconductor element mounted on the first surface of the carrier layer and coupled to the ground plane and the microstrip line;
• a mold layer covering the semiconductor element and the first surface of the carrier layer.