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US 2017/0324028 A1Published application
Component with reduced stress forces in the substrate
AssigneeMicronas GmbH
InventorsMarc Baumann, Thilo Rubehn, Christian Joos, Jochen Stephan
Life of this patent
Estimating the term…
Abstract
A component with a magnetic field sensor. The electronic component is located in a semiconductor substrate or on the surface of the semiconductor substrate and is surrounded at least partially, preferably largely, by a trench in the semiconductor substrate. The trench is filled with a filling material.
Claims17
A component comprising:
- a semiconductor substrate with a surface;
- a magnetic field sensor;
- and
- a trench filled with a filling material in the semiconductor substrate, said trench surrounding the magnetic field sensor at least partially, wherein the filling material is a buffer material for absorbing mechanical stresses.
1 more element
A construction element with a component comprising a semiconductor substrate with a surface;
- a magnetic field sensor;
- and a trench filled with a filling material in the semiconductor substrate, said trench surrounding the magnetic field sensor at least partially, comprising a further component that is surrounded at least partially by the trench, wherein the filling material is a buffer material for absorbing mechanical stresses.
Dependencies are inferred from the claim text.